Oberon® Hi-Point™ Open-Ceiling and Surface Mounts

The Oberon® Hi-Point™ family delivers precision‑engineered open‑ceiling and surface mounts that integrate seamlessly with any wireless enclosure. Robust construction and a low‑profile design ensure reliable support for high‑density Wi‑Fi equipment while maintaining a clean aesthetic. Each mount is compatible with standard rack dimensions, simplifying retrofits and new installations alike. Optimized airflow channels are built into the Hi-Point™ geometry, reducing hotspot formation and extending the life of critical components. The open‑ceiling configuration allows natural convection to work in concert with supplemental cooling solutions. This design approach helps data‑center operators lower energy costs associated with forced‑air cooling. Installation flexibility is a core advantage; mounts can be positioned on ceilings, walls, or raised floors to match unique architectural constraints. Tool‑less mounting hardware accelerates deployment and minimizes onsite labor. Because the system is modular, additional access points can be added without re‑engineering the enclosure layout. Oberon® Hi-Point™ mounts are frequently paired with leading access‑point brands such as Aruba® and Cisco Meraki™ to create secure, high‑performance wireless zones. The mounting solution protects the access point's antenna array while providing secure grounding and vibration damping. This results in consistent signal quality and reduced maintenance intervals. Overall, the Oberon® Hi-Point™ open‑ceiling and surface mounts empower enterprises to scale wireless coverage rapidly, maintain optimal thermal conditions, and protect valuable network assets. Explore the full range of wireless enclosure solutions to future‑proof your campus or data‑center environment.